Numerical analysis of a thermal contact problem with adhesion

Oanh Chau

doi:10.1007/s40314-018-0642-2

Journal articles

Numerical analysis of a thermal contact problem with adhesion

Oanh Chau ¹

1 PIMENT - Physique et Ingénierie Mathématique pour l'Énergie, l'environnemeNt et le bâtimenT

Document type :

Journal articles

Domain :

Mathematics [math]

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https://hal.univ-reunion.fr/hal-02369188
Contributor : Mathieu David <>
Submitted on : Monday, November 18, 2019 - 6:33:04 PM
Last modification on : Tuesday, November 19, 2019 - 1:35:52 AM

Numerical analysis of a thermal contact problem with adhesion

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Numerical analysis of a thermal contact problem with adhesion

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