Numerical analysis of a thermal contact problem with adhesion

Oanh Chau 1
1 PIMENT - Physique et Ingénierie Mathématique pour l'Énergie, l'environnemeNt et le bâtimenT
Document type :
Journal articles
Complete list of metadatas
https://hal.univ-reunion.fr/hal-02369188
Contributor : Mathieu David <>
Submitted on : Monday, November 18, 2019 - 6:33:04 PM
Last modification on : Tuesday, November 19, 2019 - 1:35:52 AM

Identifiers

Collections

UNIV-REUNION | INSMI | PIMENT | PAPANGUE

Citation

Oanh Chau. Numerical analysis of a thermal contact problem with adhesion. Computational and Applied Mathematics, Springer Verlag, 2018, 37 (4), pp.5424-5455. ⟨10.1007/s40314-018-0642-2⟩. ⟨hal-02369188⟩

Export

BibTeX TEI DC DCterms EndNote

Share

Metrics

Record views

24

Contact

Informations

CCSD