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Numerical analysis of a thermal contact problem with adhesion

Oanh Chau 1
1 PIMENT - Physique et Ingénierie Mathématique pour l'Énergie, l'environnemeNt et le bâtimenT
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https://hal.univ-reunion.fr/hal-02369188
Contributor : Mathieu David <>
Submitted on : Monday, November 18, 2019 - 6:33:04 PM
Last modification on : Thursday, July 1, 2021 - 3:05:05 AM

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Oanh Chau. Numerical analysis of a thermal contact problem with adhesion. Computational and Applied Mathematics, Springer Verlag, 2018, 37 (4), pp.5424-5455. ⟨10.1007/s40314-018-0642-2⟩. ⟨hal-02369188⟩

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